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Japan Times: China readying $143 billion package for its chip firms in face of U.S. curbs

Tue December, 2022, Age: 3 months

China is working on a more than 1 trillion yuan ($143 billion) support package for its semiconductor industry, three sources said, in a major step toward self-sufficiency in chips and to counter U.S. moves aimed at slowing its technological advances.


Back Taipei Times: Local TSMC suppliers divided over US move
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